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this is information on a product in full production. june 2012 doc id 15025 rev 3 1/11 11 ESDALC12-1T2 single line transient su rge voltage suppressor (tvs) for data and power line datasheet ? production data features stand-off voltage 10 v unidirectional device low clamping factor v cl /v br breakdown voltage v br = 12 v min. fast response time very thin package: 0.4 mm low leakage current rohs compliant benefits high esd robustness of the application suitable for high density boards complies with the following standards: iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g - method 3015-7: class 3b applications where transient overvoltage protection and electrical overstress protection in sensitive equipment are required, such as: computers printers communication systems cellular phone handsets and accessories video equipment figure 1. functional diagram description the ESDALC12-1T2 is a unidirectional single line transil? diode designed specially for protection of integrated circuits in portable equipment and miniaturized electronic devices subjected to esd and eos transient over voltages. packed in sod882t, it minimizes pcb occupation. tm : transil is a trademark of stmicroelectronics sod882t gnd 3 gnd i/o1 gnd www.st.com
characteristics ESDALC12-1T2 2/11 doc id 15025 rev 3 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage - iec 61000-4-2 air discharge contact discharge 25 20 kv p pp peak pulse power dissipation (8/20 s) (1) t j initial = t amb 50 w i pp peak pulse current (8/20 s) (1) 2a t j operating junction temperature range - 40 to + 125 c t stg storage temperature range - 55 to +150 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage v = clamping voltage r = dynamic impedance i = peak pulse current i = breakdown current t = voltage temperature coefficient v = forward voltage drop br rm rm rm cl d pp r f i v i f i rm i pp v rm v f v br slope = 1/rd v cl table 2. electrical characteristics (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 12 14 v i rm v rm = 10 v 200 na r d 1 a to 3 a, 8/20 s 1.9 v cl i pp = 1 a, 8/20s 20 v cv r = 0 v dc, f = 1 mhz, v osc = 30 mv rms 15 18 pf
ESDALC12-1T2 characteristics doc id 15025 rev 3 3/11 figure 3. peak pulse power dissipation versus initial junction temperature figure 4. peak pulse power versus exponential pulse duration 0 10 20 30 40 50 60 70 80 90 100 0 25 50 75 100 125 150 175 8/20 s p (w) pp t (c) j tj = 125 c 1 10 100 1000 1 10 100 1000 p (w) pp t initial = 25 c j t (s) p figure 5. clamping voltage versus peak pulse current (maximum values) figure 6. forward voltage drop versus peak forward current (typical values) figure 7. junction capacitance versus reverse applied voltage (typical values) figure 8. leakage current versus junction temperature (typical values) 0.1 1.0 10.0 12 14 16 18 20 22 24 26 28 i (a) pp v (v) cl 8/20 s t initial = 25 c j 0.00 0.01 0.10 1.00 10.00 0.0 0.5 1.0 1.5 2.0 2.5 3.0 t = 25 c j i (a) fm v (v) fm 0 2 4 6 8 10 12 14 16 012345 c(pf) v (v) r f = 1 mhz v = 30 mv v= 0v t = 25 c osc rms r j 0.01 0.10 1.00 10.00 25 50 75 100 125 i (na) r t (c) j v=v =10v rrm
characteristics ESDALC12-1T2 4/11 doc id 15025 rev 3 figure 11. s21 attenuation measurement figure 9. esd response to iec 61000-4-2 (+15 kv air discharge) on each channel figure 10. esd response to iec 61000-4-2 (-15 kv air discharge) on each channel 100 ns/div 10 v/div 5 v/div 100 ns/div 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 f (hz) db
ESDALC12-1T2 ordering information scheme doc id 15025 rev 3 5/11 2 ordering information scheme figure 12. ordering information scheme esda lc 12 - 1 t2 esd array low capacitance package t2 = sod882t breakdown voltage number of lines 12 = 12 volt min.
package information ESDALC12-1T2 6/11 doc id 15025 rev 3 3 package information epoxy meets ul94, v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. sod882 dimension definitions table 3. sod882 dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.40 0.47 0.50 0.016 0.019 0.020 a1 0.00 0.05 0.000 0.002 b1 0.45 0.50 0.55 0.018 0.020 0.022 b2 0.45 0.50 0.55 0.018 0.020 0.022 d 0.55 0.60 0.65 0.022 0.024 0.026 e 0.95 1.00 1.05 0.037 0.039 0.041 e 0.60 0.65 0.70 0.024 0.026 0.028 l1 0.20 0.25 0.30 0.008 0.010 0.012 l2 0.20 0.25 0.30 0.008 0.010 0.012 pin # 1 id e d a1 a l1 e l2 b2 b1
ESDALC12-1T2 package information doc id 15025 rev 3 7/11 note: product marking may be rotated by multiples of 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. figure 16. tape and reel specifications figure 14. footprint (dimensions in mm) figure 15. marking 0.55 (0.022) 0.40 (0.016) 0.50 0.020 0.55 (0.022) n pin 2 n pin1 pin 2 v i cathode bar user direction of unreeling all dimensions in mm 4.0 2.0 8.0 2.0 1.75 3.5 ? 1.55 0.6 0.68 0.20 1.10 n n n n n n n
recommendation on pcb assembly ESDALC12-1T2 8/11 doc id 15025 rev 3 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 17. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio - between 60% and 65%. figure 18. recommended stencil windows position 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = lead footprint on pcb stencil window position lead footprint on pcb package footprint 0.45 mm 0.39 mm 0.05 mm 0.05 mm stencil window position 0.055 mm
ESDALC12-1T2 recommendation on pcb assembly doc id 15025 rev 3 9/11 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placemen t system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away. 4.5 reflow profile figure 19. st ecopack? recommended soldering reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 60 sec (90 max) 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -2 c/s to -3 c/s -6 c/s max 240-245 c 2 - 3 c/s 0.9 c/s temperature (c) time (s)
ordering information ESDALC12-1T2 10/11 doc id 15025 rev 3 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDALC12-1T2 v (1) 1. the marking can be rotated by multiples of 90 to differentiate assembly location sod882t 0.76 mg 12000 tape and reel table 5. document revision history date revision changes 16-sep-2008 1 initial release 02-nov-2010 2 updated ta bl e 1 , base quantity change on ta bl e 4 and updated graphics. 13-jun-2012 3 added figure 13 , updated ta bl e 3 and added note after figure 15 .
ESDALC12-1T2 doc id 15025 rev 3 11/11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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